Patent Assignment
Reel/Frame 041720/0806
Assignment of Assignor's Interest
Recorded: 2017-03-24
Pages: 6
Assignors
KIM, JI-HWANG
Executed: 2016-12-27
SHIM, JONG-BO
Executed: 2016-12-27
JO, CHA-JEA
Executed: 2016-12-27
LEE, WON-IL
Executed: 2016-12-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Rewiring Layer with an Embedded Chip