Patent Assignment
Reel/Frame 041722/0503
Assignment of Assignor's Interest
Recorded: 2017-03-24
Pages: 2
Assignor
HOKARI, SUMIO
Executed: 2017-03-12
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Semiconductor Package, Sensor Module, and Production Method