Patent Assignment
Reel/Frame 041749/0334
Assignment of Assignor's Interest
Recorded: 2017-03-27
Pages: 8
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Data Storage Device Having Multi-Stack Chip Package and Operating Method Thereof