Patent Assignment
Reel/Frame 041782/0533
Assignment of Assignor's Interest
Recorded: 2017-02-22
Pages: 7
Assignors
KIM, BO SOON
Executed: 2017-01-06
KIM, HYUN JI
Executed: 2017-01-06
LEE, JEONG YUN
Executed: 2017-01-06
PARK, GI GWAN
Executed: 2017-01-07
PARK, SANG DUK
Executed: 2017-01-06
OH, YOUNG MOOK
Executed: 2017-01-06
LEE, YONG SEOK
Executed: 2017-01-06
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Fabricating Method Thereof