Patent Assignment
Reel/Frame 041933/0687
Assignment of Assignor's Interest
Recorded: 2017-04-07
Pages: 5
Assignors
SAMADI, KAMBIZ
Executed: 2017-03-09
ANSARI, AMIN
Executed: 2017-03-09
DU, YANG
Executed: 2017-03-31
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
MULTI-PROCESSOR CORE THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs), AND RELATED METHODS