Patent Assignment
Reel/Frame 042003/0584
Assignment of Assignor's Interest
Recorded: 2017-04-13
Pages: 3
Assignors
KIM, JONG HOON
Executed: 2016-04-02
SUNG, KI JUN
Executed: 2016-04-02
YOO, YOUNG GEUN
Executed: 2016-04-02
CHOI, HYEONG SEOK
Executed: 2016-04-02
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Manufacturing Methods Semiconductor Packages Including Through Mold Connectors
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.