Patent Assignment
Reel/Frame 042007/0558
Assignment of Assignor's Interest
Recorded: 2017-04-14
Pages: 3
Assignee
INTEL IP CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Shielding Solutions for Direct Chip Attach Connectivity Module Package Structures Having Shielding Structures Attached to Package Structures
Application:
15/474,251 →
Publication:
US 2018/0286815
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.