Patent Assignment
Reel/Frame 042127/0728
Assignment of Assignor's Interest
Recorded: 2017-04-24
Pages: 6
Assignors
CHO, KYONGSOON
Executed: 2017-03-02
KIL, MYOUNGKYUN
Executed: 2017-03-02
RYU, HANSUNG
Executed: 2017-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same