Patent Assignment
Reel/Frame 042153/0295
Assignment of Assignor's Interest
Recorded: 2017-04-26
Pages: 3
Assignee
ASAHI GLASS COMPANY, LIMITED
5-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8405, JAPAN
Covered Property
(1)
Substrate Suction Device, Substrate Bonding Device, Substrate Bonding Method, and Electronic Device Manufacturing Method
Application:
15/497,960 →
Publication:
US 2017/0266943
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.