Patent Assignment
Reel/Frame 042154/0121
Assignment of Assignor's Interest
Recorded: 2017-04-26
Pages: 4
Assignors
LAI, WEI-HAN
Executed: 2016-12-23
WANG, CHIEN-WEI
Executed: 2016-12-23
CHANG, CHING-YU
Executed: 2016-12-23
LIN, CHIN-HSIANG
Executed: 2016-12-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Material Composition and Process for Substrate Modification