Patent Assignment
Reel/Frame 042187/0567
Assignment of Assignor's Interest
Recorded: 2017-04-28
Pages: 5
Assignors
CHANG, WON-GI
Executed: 2016-12-23
KIM, YEONGSEOK
Executed: 2016-12-23
YOO, HYEIN
Executed: 2016-12-23
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating a Fan-Out Panel Level Package and a Carrier Tape Film Therefor