Patent Assignment
Reel/Frame 042227/0107
Assignment of Assignor's Interest
Recorded: 2017-05-03
Pages: 4
Assignors
MATSUBARA, NORIE
Executed: 2017-03-13
ISHIKAWA, SHINJI
Executed: 2017-03-13
UNO, TOMOHIRO
Executed: 2017-03-13
SHIMIZU, TAKAYUKI
Executed: 2017-03-13
KITAMURA, NAOYA
Executed: 2017-03-13
Assignee
NIPPON STEEL & SUMITOMO METAL CORPORATION
6-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8071, JAPAN
Covered Property
(1)
Conductive Bonded Assembly of Electronic Component, Semiconductor Device Using Same, and Method of Production of Conductive Bonded Assembly
Application:
15/523,865 →
Publication:
US 2017/0317048
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.