Patent Assignment
Reel/Frame 042247/0398
CHANGE OF NAME
Recorded: 2017-05-04
Received: 2017-05-04
Pages: 8
Assignor
HITACHI HOKKAI SEMICONDUCTOR, LTD.
Executed: 2002-10-07
Assignee
NORTHERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
39, 1007, IZUMISAWA, CHITOSE-SHI, HOKKAI-DO, JPX, JAPAN
Covered Applications
(13)
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 11/802,451
→
MICROCOMPUTER, PROGRAMMING METHOD AND ERASING METHOD
App. No. 11/672,468
→
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 11/062,615
→
MICROCOMPUTER, PROGRAMMING METHOD AND ERASING METHOD
App. No. 11/037,261
→
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 10/996,464
→
ANALOG SWITCH CIRCUIT
App. No. 10/283,110
→
SEMICONDUCTOR DEVICE WITH AN INPUT/OUTPUT INTERFACE CIRCUIT FOR A BUS
App. No. 10/256,025
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
App. No. 10/247,505
→
SEMICONDUCTOR DEVICE
App. No. 10/152,727
→
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
App. No. 10/123,242
→
MICROCOMPUTER AND DATA PROCESSING DEVICE
App. No. 10/079,619
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
App. No. 09/965,221
→
ANALOG SWITCH CIRCUIT
App. No. 09/960,925
→