Patent Assignment
Reel/Frame 042354/0601
Assignment of Assignor's Interest
Recorded: 2017-05-12
Pages: 4
Assignor
ISHII, RYUICHI
Executed: 2017-04-12
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Molded Resin-Sealed Power Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.