Assignment of Assignor's Interest

Recorded: 2017-05-11 Pages: 5

Assignors

QI, QUAN

Executed: 2017-04-04

HANNA, CARLTON E.

Executed: 2017-03-30

MANN, EYTAN

Executed: 2017-04-02

DALMIA, SIDHARTH

Executed: 2017-04-02

Assignee

INTEL IP CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Partially Molded Direct Chip Attach Package Structures for Connectivity Module Solutions

Patent: 10,049,961 →

Application: 15/474,301 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.