Patent Assignment
Reel/Frame 042504/0364
Assignment of Assignor's Interest
Recorded: 2017-05-25
Pages: 7
Assignors
JEONG, CHAN-HEE
Executed: 2017-03-30
PARK, SOO-JAE
Executed: 2017-04-03
KIM, YOUNG-HOON
Executed: 2017-03-31
KANG, IN-KU
Executed: 2017-03-29
KIM, HEE-YEOL
Executed: 2017-04-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Package, Method of Fabricating the Same, and Wearable Device Including Integrated Circuit Package