IP Library › Assignment 042609/0807
Patent Assignment
Reel/Frame 042609/0807

MERGER

Recorded: 2017-05-12 Received: 2017-06-05 Pages: 13
Assignor
Assignee
RENESAS SEMICONDUCTOR KYUSHU YAMAGUCHI CO., LTD.
1-1, 1-CHOME, YAHATA, MINAMI-KU, KUMAMOTO-SHI, KUMAMOTO, JPX, JAPAN
Covered Applications (48)
MOSFET PACKAGE
App. No. 13/906,771
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FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 13/607,864
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MOSFET PACKAGE
App. No. 13/459,839
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FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 12/956,524
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MOLD CLEANING SHEET AND METHOD OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME
App. No. 12/906,421
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FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 12/836,432
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FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 12/729,102
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MOLD CLEANING SHEET AND METHOD OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME
App. No. 12/494,891
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MOLD CLEANING SHEET AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE USING THE SAME
App. No. 12/424,075
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MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
App. No. 12/213,779
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FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 12/118,348
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MOSFET PACKAGE
App. No. 12/046,741
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SEMICONDUCTOR DEVICE HAVING STRAINED SILICON FILM
App. No. 11/969,154
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FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 11/837,168
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MOLD CLEANING SHEET AND METHOD OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME
App. No. 11/431,508
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MOSFET PACKAGE
App. No. 11/415,291
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MOSFET PACKAGE
App. No. 11/415,290
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FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 11/320,888
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MOLD CLEANING SHEET AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE USING THE SAME
App. No. 11/218,603
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SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND IMAGING SYSTEM
App. No. 11/000,415
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METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 10/930,845
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MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
App. No. 10/902,785
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METHOD OF FABRICATION OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 10/901,999
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IMAGE INPUT SYSTEM
App. No. 10/823,642
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SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND IMAGING SYSTEM
App. No. 10/816,925
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SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND IMAGING SYSTEM
App. No. 10/817,042
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
App. No. 10/812,869
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METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE WITH ELEVATED TUB
App. No. 10/752,676
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FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 10/682,028
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SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
App. No. 10/669,564
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A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A FLEXIBLE WIRING SUBSTRATE
App. No. 10/653,894
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FABRICATION METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
App. No. 10/440,102
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METHOD OF BONDING INNER LEADS TO CHIP PADS
App. No. 10/318,246
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MOLD CLEANING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES USING THE SAME
App. No. 10/296,724
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DRIVE CONTROL SYSTEM FOR SENSOR-LESS MOTOR
App. No. 10/291,831
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/279,827
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METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 10/187,003
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SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
App. No. 10/108,483
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SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
App. No. 10/108,439
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SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE SORTING SYSTEM TO BE USED WITH THE SAME
App. No. 10/083,503
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MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
App. No. 10/082,311
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SEMICONDUCTOR PACKAGE WITH ELEVATED TUB
App. No. 09/988,645
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METHOD OF DICING TO FORM ENCAPULATED SEMICONDUCTOR DEVICE
App. No. 09/961,368
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CIRCUIT DESIGN METHOD AND CIRCUIT DESIGN APPARATUS
App. No. 09/939,590
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RADIO COMMUNICATION APPARATUS AND RADIO FREQUENCY POWER AMPLIFIER
App. No. 09/881,013
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A SEMICONDUCTOR DEVICE SWITCHING REGULATOR USED AS A DC REGULATED POWER SUPPLY
App. No. 09/842,015
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DIRECT-CURRENT POWER-SUPPLY APPARATUS, CONTROL CIRCUIT THEREOF AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR POWER SUPPLY
App. No. 09/809,997
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METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
App. No. 09/783,605
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