Patent Assignment
Reel/Frame 042681/0058
Assignment of Assignor's Interest
Recorded: 2017-06-13
Pages: 5
Assignors
GAO, ZIYANG
Executed: 2017-06-08
SHI, XUNQING
Executed: 2017-06-08
CHOW, SHI WO
Executed: 2017-06-08
Assignee
HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE CO. LTD.
5/F, PHOTONICS CENTRE, 2 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, HONG KONG, CHINA
Covered Property
(1)
Three Dimensional Fully Molded Power Electronics Module Having a Plurality of Spacers for High Power Applications