IP Library › Assignment 042723/0109
Patent Assignment
Reel/Frame 042723/0109

Change of Name

Recorded: 2017-06-07 Pages: 5
Assignor
DOW GLOBAL TECHNOLOGIES INC.
Executed: 2010-12-31
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property (1)
System for Bonding Glass into a Structure
Patent: 7,819,964 →
Application: 11/707,701 →
Publication: US 2008/0199607
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 069923/0030 →
Change of Legal Entity Sep 10, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068907/0881 →
Assignment of Assignor's Interest Sep 10, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068922/0001 →