Patent Assignment
Reel/Frame 042725/0231
Assignment of Assignor's Interest
Recorded: 2017-06-15
Pages: 2
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Semiconductor Device