Patent Assignment
Reel/Frame 042883/0724
Assignment of Assignor's Interest
Recorded: 2017-07-03
Pages: 3
Assignors
CHEN, YING-JU
Executed: 2017-06-13
YEH, DER-CHYANG
Executed: 2017-06-19
CHEN, HSIEN-WEI
Executed: 2017-06-13
TAI, SHIH-PENG
Executed: 2017-06-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Alignment Pattern for Package Singulation