Patent Assignment
Reel/Frame 042900/0053
Assignment of Assignor's Interest
Recorded: 2017-07-05
Pages: 3
Assignors
LEE, HSIAO-WEN
Executed: 2017-06-27
LIU, HSIEN-WEN
Executed: 2017-06-27
JENG, SHIN-PUU
Executed: 2017-06-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method for Forming the Same