Patent Assignment
Reel/Frame 042990/0416
Assignment of Assignor's Interest
Recorded: 2017-07-12
Pages: 9
Assignors
PADMANABHAN, BALAJI
Executed: 2015-09-11
VENKATRAMAN, PRASAD
Executed: 2015-09-11
HOSSAIN, ZIA
Executed: 2015-09-11
MCDONALD, JASON
Executed: 2015-09-14
SALIH, ALI
Executed: 2015-09-11
YOUNG, ALEXANDER
Executed: 2015-09-11
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL RD., MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Method of Forming a Heterojunction Semiconductor Device Having Integrated Clamping Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 12, 2017
From: LIU, CHUN-LI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042990/0450 →
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0460 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0460
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064075/0001 →