Patent Assignment
Reel/Frame 042994/0136
Assignment of Assignor's Interest
Recorded: 2017-07-13
Pages: 6
Assignors
CHANG, MING-HONG
Executed: 2017-05-16
LIN, HSIN-CHIH
Executed: 2017-07-02
WANG, SHEN-PING
Executed: 2017-05-16
CHEN, CHUNG-CHENG
Executed: 2017-05-16
KUO, CHIEN-LI
Executed: 2017-05-16
CHU, PO-TAO
Executed: 2017-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Group Iii-V Device Structure