Patent Assignment
Reel/Frame 043067/0438
Assignment of Assignor's Interest
Recorded: 2017-07-21
Pages: 4
Assignor
AOKI, KATSUYUKI
Executed: 2017-06-07
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
TOSHIBA MATERIALS CO., LTD.
8, SHINSUGITA-CHO, ISOGO-KU, YOKOHAMA-SHI, KANAGAWA-KEN, 235-8522, JAPAN
Covered Property
(1)
High Thermal Conductive Silicon Nitride Sintered Body, and Silicon Nitride Substrate and Silicon Nitride Circuit Board and Semiconductor Apparatus Using the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment
Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MATERIALS CO. LTD.
Reel/Frame 074940/0511 →
Change of Name
Feb 19, 2026
From: TOSHIBA MATERIALS CO. LTD.
To: NITERRA MATERIALS CO., LTD.
Reel/Frame 074941/0803 →
Change of Address
Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 074941/0846 →