Patent Assignment
Reel/Frame 043104/0680
Assignment of Assignor's Interest
Recorded: 2017-07-26
Pages: 7
Assignors
KIM, YOON-JAE
Executed: 2017-06-29
KIM, HO-YOUNG
Executed: 2017-06-29
KIM, DONG-KWON
Executed: 2017-06-29
YOO, JIN-HYUK
Executed: 2017-06-29
JUNG, WOO-JIN
Executed: 2017-06-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Utilizing Capping Layers with Multiple Widths and Methods of Manufacturing the Same
Patent:
10,043,879 →
Application:
15/660,432 →