Patent Assignment
Reel/Frame 043124/0012
Assignment of Assignor's Interest
Recorded: 2017-07-28
Pages: 4
Assignors
WU, CHENG-TA
Executed: 2017-07-17
WU, CHII-MING
Executed: 2017-07-19
SYUE, SEN-HONG
Executed: 2017-07-19
CHAU, CHENG-PO
Executed: 2017-07-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device Having Isolation Structures with Different Thicknesses and Method of Forming the Same