Patent Assignment
Reel/Frame 043142/0667
Assignment of Assignor's Interest
Recorded: 2017-07-31
Pages: 3
Assignor
BEROZ, MASUD
Executed: 2017-01-12
Assignee
COMPONENTZEE, LLC
9916 MORRISVILLE PARKWAY, APEX, NORTH CAROLINA, 27523
Covered Properties
(8)
Multiplexing, Switching and Testing Devices and Methods Using Fluid Pressure
Fluid pressure activated high density Wafer testing probe card
Application:
62/068,663 →
Fluid pressure activated high density wafer testing probe card and test socket
Application:
62/069,843 →
High Density Led Wafer Level Testing and Sorting Probe Card /Contactor
Application:
62/077,941 →
High Density Led Wafer Level Testing and Sorting Probe Card Contactor and Led Color Testing Improvements
Application:
62/079,255 →
Quick Connect/Disconnect for Robotics and Industrial Applications Using Fluid Pressure as a Contact Force
Application:
62/080,434 →
Using a Multiplexer switching device or double face test to reduce the number of routing conduits
Application:
62/080,435 →
Using Fluid pressure as multiplexing or switching device
Application:
62/128,495 →
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.