Patent Assignment
Reel/Frame 043152/0829
Assignment of Assignor's Interest
Recorded: 2017-08-01
Pages: 14
Assignors
PAVIER, MARK
Executed: 2017-07-10
HABLE, WOLFRAM
Executed: 2017-07-10
KESSLER, ANGELA
Executed: 2017-07-11
SIELAFF, MICHAEL
Executed: 2017-07-10
PUGATSCHOW, ANTON
Executed: 2017-07-10
RIMBERT-RIVIERE, CHARLES
Executed: 2017-07-10
SOBKOWIAK, MARCO
Executed: 2017-07-10
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Molded package with chip carrier comprising brazed electrically conductive layers
Patent:
10,074,590 →
Application:
15/649,459 →