Patent Assignment
Reel/Frame 043220/0116
Assignment of Assignor's Interest
Recorded: 2017-08-07
Pages: 3
Assignor
YAMAMOTO, SUKEHIRO
Executed: 2017-08-02
Assignee
SII SEMICONDUCTOR CORPORATION
8, NAKASE 1-CHOME MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Polishing Head, Cmp Apparatus Including a Polishing Head, and Manufacturing Method of Semiconductor Integrated Circuit Device Using a Cmp Apparatus
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.