Patent Assignment
Reel/Frame 043246/0458
Assignment of Assignor's Interest
Recorded: 2017-08-09
Pages: 3
Assignor
UTSUNOMIYA, HIROYUKI
Executed: 2017-07-26
Assignee
SII SEMICONDUCTOR CORPORATION
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Semiconductor Device Having a Large Area Interconnect or Pad
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.