Patent Assignment
Reel/Frame 043272/0253
Assignment of Assignor's Interest
Recorded: 2017-08-11
Pages: 4
Assignors
SHIH, YING-CHING
Executed: 2017-08-01
WU, CHI-HSI
Executed: 2017-08-07
YU, CHEN-HUA
Executed: 2017-08-03
WU, CHIH-WEI
Executed: 2017-08-01
LIN, JING-CHENG
Executed: 2017-08-01
WANG, PU
Executed: 2017-08-01
LU, SZU-WEI
Executed: 2017-08-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structures and Methods of Forming the Same