Patent Assignment
Reel/Frame 043285/0572
Assignment of Assignor's Interest
Recorded: 2017-08-14
Pages: 3
Assignors
NEFF, JAMES G.
Executed: 2009-02-24
EPLER, JOHN E.
Executed: 2009-02-24
SCHIAFFINO, STEFANO
Executed: 2009-02-24
Assignees
PHILIPS LUMILEDS LIGHTING COMPANY, LLC
370 W. TRIMBLE RD., SAN JOSE, CALIFORNIA, 95131
KONINKLIJKE PHILIPS ELECTRONICS N.V.
GROENEWOUDSEWEG 1, EINDHOVEN, 5621 BA, NETHERLANDS
Covered Property
(1)
Method of Bonding a Semiconductor Device Using a Compliant Bonding Structure
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
Change of Name
Aug 14, 2017
From: PHILIPS LUMILEDS LIGHTING COMPANY, LLC
To: LUMILEDS LLC
Reel/Frame 043543/0662 →
Change of Name
Aug 14, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 043543/0903 →
Assignment of Assignor's Interest
Aug 22, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 043637/0422 →
Security Interest
Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
Release of Security Interest
Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
Assignment of Assignor's Interest
Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →