Patent Assignment
Reel/Frame 043698/0110
Assignment of Assignor's Interest
Recorded: 2017-09-26
Pages: 3
Assignors
LEE, SANG-EUN
Executed: 2017-09-14
LEE, HYUNG-DONG
Executed: 2017-09-15
KO, EUN
Executed: 2017-09-14
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Semiconductor Package Having Mold Vias and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.