Patent Assignment
Reel/Frame 043744/0420
Assignment of Assignor's Interest
Recorded: 2017-09-29
Pages: 3
Assignor
HOEGERL, JUERGEN
Executed: 2017-09-29
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Semiconductor Chip Package Comprising Semiconductor Chip and Leadframe Disposed Between Two Substrates
Patent:
10,002,821 →
Application:
15/720,985 →