Patent Assignment
Reel/Frame 043860/0876
Assignment of Assignor's Interest
Recorded: 2017-10-13
Pages: 5
Assignors
BANDOH, MASAAKI
Executed: 2017-10-10
KINOSHITA, HIROAKI
Executed: 2017-10-10
MIZOGUCHI, FUMITAKE
Executed: 2017-10-10
YAMADA, TOMOO
Executed: 2017-10-10
OHSAWA, OSAMU
Executed: 2017-10-10
YAMAUCHI, KOJI
Executed: 2017-10-10
Assignee
LENOVO (SINGAPORE) PTE. LTD.
151 LORONG CHUAN, #02-01 NEW TECH PARK, SINGAPORE, 556741, SINGAPORE
Covered Property
(1)
Connector Substrate Assembly, Electronic Device, and Method for Assembling Electronic Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.