Patent Assignment
Reel/Frame 043896/0800
Assignment of Assignor's Interest
Recorded: 2017-10-18
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2017-10-02
YEH, SUNG-FENG
Executed: 2017-09-29
CHEN, MING-FA
Executed: 2017-10-02
CHEN, HSIEN-WEI
Executed: 2017-10-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Packages with Si-Substrate-Free Interposer and Method Forming Same