Patent Assignment
Reel/Frame 043897/0295
Assignment of Assignor's Interest
Recorded: 2017-10-18
Pages: 3
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3FL., 157 LI-TE ROAD, PEITOU DIST., TAIPEI, 11259, TAIWAN
Covered Property
(1)
Interconnect Substrate Having Cavity for Stackable Semiconducotr Assembly, Manufacturing Method Thereof and Vertically Stacked Semiconductor Assembly Using the Same