IP Library › Assignment 044113/0458
Patent Assignment
Reel/Frame 044113/0458

Assignment of Assignor's Interest

Recorded: 2017-11-13 Pages: 8
Assignors
CHAKRAVARTY, SIDDHARTH
Executed: 2017-11-02
YELEHANKA, PRADEEP
Executed: 2017-11-03
YIK, CHUN HOE
Executed: 2017-11-03
KUMAR, RAKESH
Executed: 2017-11-03
RAJASEKARAN, NATARAJAN
Executed: 2017-11-03
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property (1)
Wafer Level Packaging for Mems Device
Application: 15/810,163 →
Publication: US 2019/0144265
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 16, 2020
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
Reel/Frame 051828/0252 →