Patent Assignment
Reel/Frame 044197/0693
Assignment of Assignor's Interest
Recorded: 2017-11-22
Pages: 3
Assignors
WATANABE, TSUBASA
Executed: 2017-11-06
KONO, TSUTOMU
Executed: 2017-11-08
YOGO, TAKAYUKI
Executed: 2017-11-07
HOSHIKA, HIROAKI
Executed: 2017-11-07
Assignee
HITACHI AUTOMOTIVE SYSTEMS, LTD.
2520, TAKABA, HITACHINAKA-SHI, IBARAKI, JAPAN
Covered Property
(1)
Resin Molding and Sensor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.