Patent Assignment
Reel/Frame 044199/0912
Assignment of Assignor's Interest
Recorded: 2017-11-22
Pages: 4
Assignors
RAE, DAVID FRASER
Executed: 2017-11-09
WE, HONG BOK
Executed: 2017-11-09
HEALY, CHRISTOPHER
Executed: 2017-11-09
KIM, CHIN-KWAN
Executed: 2017-11-09
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Thermal and Electromagnetic Interference Shielding for Die Embedded in Package Substrate