Patent Assignment
Reel/Frame 044251/0158
Assignment of Assignor's Interest
Recorded: 2017-11-29
Pages: 3
Assignee
LG CHEM, LTD.
128, YEOUI-DAERO, YEONGDEUNGPO-GU, SEOUL, 07336, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board Heat Dissipation System Using Highly Conductive Heat Dissipation Pad
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.