Assignment of Assignor's Interest

Recorded: 2017-12-18 Pages: 3

Assignor

SAKUMA, TETSUYA

Executed: 2017-11-16

Assignee

SII SEMICONDUCTOR CORPORATION

8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN

Covered Property (1)

Semiconductor Device and Method of Manufacturing a Semiconductor Device

Application: 15/845,189 →

Publication: US 2018/0247903

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.