IP Library Assignment 044579/0177
Patent Assignment
Reel/Frame 044579/0177

Assignment of Assignor's Interest

Recorded: 2018-01-10 Pages: 4
Assignors
PENG, HSIAO-HUA
Executed: 2017-12-18
CHEN, HANN-RU
Executed: 2017-12-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Heating Platform, Thermal Treatment and Manufacturing Method
Application: 15/866,479 →
Publication: US 2019/0148185