Patent Assignment
Reel/Frame 044600/0528
Assignment of Assignor's Interest
Recorded: 2018-01-11
Pages: 4
Assignors
LIN, JIA-MING
Executed: 2015-07-30
JANGJIAN, SHIU-KO
Executed: 2015-07-30
LIN, CHUN-CHE
Executed: 2015-07-30
WANG, YING-LANG
Executed: 2015-07-30
LIN, WEI-KEN
Executed: 2015-07-30
LIU, CHUAN-PU
Executed: 2015-07-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method for Forming Trench Structure of Semiconductor Device