Patent Assignment
Reel/Frame 044614/0364
Assignment of Assignor's Interest
Recorded: 2018-01-12
Pages: 8
Assignors
GERBER, MARK
Executed: 2017-10-16
RICE, RICH
Executed: 2017-10-03
FACTOR, BRADFORD
Executed: 2017-10-05
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure, Package on Package Structure and Packaging Method