Patent Assignment
Reel/Frame 044662/0194
Assignment of Assignor's Interest
Recorded: 2018-01-19
Pages: 3
Assignee
UNIVERSITY OF TOKYO
7-3-1 HONGOU BUNKYOU-KU, TOKYO, 103-8338, JAPAN
Covered Property
(1)
Thin Film Semiconductor Comprising a Small-Molecular Semiconducting Compound and a Non-Conductive Polymer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 19, 2018
From: WEITZ, THOMAS; GESSNER, THOMAS
To: BASF SE
Reel/Frame 044662/0183 →
Assignment of Assignor's Interest
Jun 13, 2018
From: THE UNIVERSITY OF TOKYO
To: BASF SE
Reel/Frame 046069/0626 →
Assignment of Assignor's Interest
Apr 22, 2020
From: BASF SE
To: CLAP CO., LTD.
Reel/Frame 052459/0201 →