IP Library › Assignment 044693/0902
Patent Assignment
Reel/Frame 044693/0902

Merger

Recorded: 2017-12-05 Pages: 8
Assignor
SMART PAC GMBH TECHNOLOGY SERVICES
Executed: 2017-05-15
Assignee
PAC TECH - PACKAGING TECHNOLOGIES GMBH
AM SCHLANGENHORST 7-9, D-14641 NAUEN, GERMANY
Covered Properties (3)
Method for the Production of a Soldered Connection
Patent: 7,360,679 →
Application: 10/416,742 →
Publication: US 2004/0060971
Chip Module and Chip Card Module for Producing a Chip Card
Patent: 7,106,599 →
Application: 10/432,651 →
Publication: US 2004/0080902
Method for the Production of a Soldered Joint
Patent: 7,726,543 →
Application: 12/036,449 →
Publication: US 2008/0142576
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 29, 2003
From: AZDASHT, GHASSEM
To: SMART PAC GMBH TECHNOLOGY SERVICES
Reel/Frame 014643/0368 →
Assignment of Assignor's Interest Nov 5, 2003
From: AZDASHT, GHASSEM
To: SMART PAC GMBH TECHNOLOGY SERVICES
Reel/Frame 014673/0524 →