Patent Assignment
Reel/Frame 044875/0566
Assignment of Assignor's Interest
Recorded: 2018-02-08
Pages: 5
Assignor
FUJIKATA, JUMPEI
Executed: 2017-12-28
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OHTA-KU, TOKYO, 144-8510, JAPAN
Covered Property
(1)
Substrate Holder, Plating Apparatus, Plating Method, and Electric Contact