Patent Assignment
Reel/Frame 045047/0467
Assignment of Assignor's Interest
Recorded: 2018-02-27
Pages: 3
Assignors
LIN, TZU-HUNG
Executed: 2018-02-05
CHANG, CHIA-CHENG
Executed: 2018-02-05
PENG, I-HSUAN
Executed: 2018-02-05
LIU, NAI-WEI
Executed: 2018-02-05
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package Structure